• Intelligent Sensing Expo

The future of sensing market appears promising, showing significant opportunities in the automotive, consumer electronics, healthcare, industrial, and aerospace & defense applications. Increased automation due to a spurring increase in various industries has dynamic impact on the sensor industry. In addition, emerging trends such as sensor miniaturization, growing advances in IoT & IIoT technology, industry 4.0, and the emerging 5.0 promote market growth.


CIOE 2024 – Intelligent Sensing Expo will showcase the latest sensing products, technologies, and applications including 3D vision, LiDAR, millimeter wave radar, MEMS sensing, and industrial sensors. This exhibition is the ideal sourcing platform for sensing components, devices and solutions for consumer electronics, advanced manufacturing, optical communication, and automotive electronics, etc.


Register now and prepare your business trip to CIOE 2024 on September 11-13, 2024 at Shenzhen World Exhibition and Convention Center.

  • Key Products

LiDAR

Mechanical LiDAR, Hybrid Solid-state LiDAR (Wedge Mirror Type, MEMS Micro-vibrator Type), Solid-state LiDAR (Flash, OPA, FWCW).

LiDAR Component

Laser, Detector, Scanner and Module, MEMS Micro-vibrating Mirror, Detector and Receiver IC, APD, SAPD, EEL PIN, SiPM, Narrow Bandpass Filter, Navigation System, etc.

LiDAR System and Solution

Laser, Detector, Scanner and Module, MEMS Micro-vibrating Mirror, Detector and Receiver IC, APD, SAPD, EEL PIN, SiPM, Narrow Bandpass Filter, Navigation System, etc.

3D Imaging and Sensing

VCESL Chip, EEL, DOE, Infrared LED, MEMS Micro Mirror, CMOS Image Sensor, CCD Image Sensor, Image Processing Chip, DDI Display Chip, etc.

3D Camera

Optical Structure Camera, TOF Camera, Binocular Stereo Vision Camera, Infrared Sensor, Infrared Optical Emitter, Infrared CMOS Image Sensor, Image Processing Chip, Sensor Module, Imaging Algorithm, etc.

Biometric

Biosensor, Fingerprint Sensor, Optical Sensor, Radio-Frequency Sensor, Temperature Sensor, Iris Recognition, Environmental Sensor, Biometric Filter, Gesture Recognition, Automatic Speech Recognition, Pressure Sensor, CMOS Sensor, Ultrasonic Sensor, DOE, MCU, FPCB, Biometric Soc Chip, Biosensor Chip, System Service Provider, etc..

MEMS and Sensor

Inertial Sensor, Pressure Sensor, Temperature Sensor, Angular Velocity Sensor, Pulse Sensor, Smoke Sensor, Fingerprint Sensor, Microphones, Acoustic Sensor, MEMS Biosensor, MEMS Image Sensor, MEMS Tactile Sensor, MEMS Microphone, Gyroscope, Accelerometer, Magnetic Sensor, ASIC Chip, Microfluidics Chip, Pressure Chip, Infrared Thermoelectric Reactor Chip, Sensor Module, Sensor Chip, MEMS/Sensor Solution, Radio-Frequency Solution, etc.

Millimeter-Wave Radar

Millimeter Wave Radar Core Device: MMIC, Baseband Digital Signal Processor, Antenna High Frequency PCB, Millimeter Wave System and Solution, etc.

Industrial Sensor

Optical Fiber Sensor, Automotive Sensor, Spectral Confocal Displacement Sensor, Photoelectric Sensor, Fiber Grating Sensor, Gas Sensor, Temperature and Humidity Sensor, Environmental Sensor, Position Sensor, Acceleration Sensor, Flow Sensor, Vision Sensor, Dynamic Torque Sensor, Ultrasonic Sensor, Liquid Level Sensor, Displacement Sensor, Resistive Sensor, Resistance-Strain Sensor, Piezoresistive Sensor, etc.

  • Key Exhibitors

  • CIOE 2023 Visitor Analysis

Visitor:108,063    Attendance:189,272     No. of Visitor Group:912

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CIOE 2024

9.11-9.12 (Wed-Thur)9:00-17:00

9.13 (Fri)9:00-16:00

Venue: Shenzhen World Exhibition
& Convention Center

+86-0755-86290901(Mon - Fri 08:30-17:30)