Exhibition Area(sqm)
Exhibitors
Expected Professional Visitors
Conferences
Time: September 9-11, 2026
Venue: Shenzhen World Exhibition and Convention Center, China
Access Asia's largest optoelectronics exhibition with 260,000 square meters—your direct gateway to China's photonics innovation ecosystem.
Connect with 3,800+ leading brands and emerging innovators—your next suppliers, partners, or clients are here.
Discover cutting-edge advancements in information and communication, precision optics, laser applications, and intelligent manufacturing where Chinese innovation excels.
Immerse yourself in the heart of Asia's innovation ecosystem, with easy access to Chinese suppliers and manufacturers.
Establish strategic partnerships with key players from the world's fastest-growing optoelectronics market in just three focused days.
Save valuable time with customized business matching services connecting you directly to relevant partners.
Keep abreast of emerging trends and advancements in China's booming optoelectronic sector.
Automotive Optical Communication Pavilion
IPEC Pavilion
Endoscopic Imaging Technology Pavilion
Telescope and Astronomical Equipment Pavilion
Humanoid Robot Pavilion
Medical Laser Pavilion
Laser Welding Pavilion
Sapphire Processing and Application Pavilion
Optical Injection Molding/Molded Aspheric Pavilion
CIOE will co-locate with the International Integrated Circuit Innovation Expo (IICIE 2026)and Shenzhen International Electronics & Embedded Expo (elexcon 2026), jointly creating a mega event spanning 340,000 square meters for the optoelectronic, semicondu
Spanning the full semiconductor ecosystem, IICIE 2026 will bring together over 1,100 industry-leading exhibitors to showcases from IC design, semiconductor manufacturing & packaging equipment, core parts and materials.
elexcon 2026 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technologies, MEMS sensors, power management ICs, power devices, industrial power supplies, passive components, and advanced packaging solutions including SiP and Chiplet.
The co-located exhibitions synergize cross-industry applications including consumer electronics, intelligent automotive, robotics, AR/VR, communications, medical electronics, defense/security and display, and catering channel resources of solution providers, system integrators, agents and distributors.