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September 9-11, 2026
Shenzhen World Exhibition & Convention Center
Shenzhen, China |
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| As the AI race moves beyond million-cluster GPU scale, the battleground for computing infrastructure is quietly shifting from chip fabrication processes to interconnect efficiency. Co-packaged optics (CPO) – the key technology to break through the interconnect bottleneck of AI compute clusters – is moving rapidly from lab validation to commercial-scale deployment this year. |
| Join us at CIOE 2026 to explore the complete CPO ecosystem, from core components to full system solutions. At the sub expo - Information & Communication Expo, you'll witness world‑class demonstrations of silicon photonic chips, high‑performance optical engines, and advanced integrated packaging purpose‑built for AI data centers. |
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| Mainstream Architecture for Next-generation Data Interconnection |
| Propelled by the explosive growth of AI large models, high-performance computing (HPC), and 5G networks, data center bandwidth demand increases by over 30% annually. Constrained by high power consumption, excessive latency, and low bandwidth density, traditional copper interconnection can no longer satisfy the demands of the AI era. |
| IDC statistics indicate around 30% of data center power consumption stems from interconnection systems, while copper cable latency exceeds that of optical fiber by more than tenfold. Against this backdrop, Co-packaged Optics (CPO) has emerged as a pivotal solution. By integrating optical engines with switching and computing ASICs on a single substrate, CO enables chip-level optical interconnection to overcome critical data transmission bottlenecks. |
| Market demand for CPO is growing exponentially. Yole projects the global CPO market will expand from approximately USD 46 million in 2024 to USD 8.1 billion by 2030, representing a CAGR of 137%. Key growth drivers include soaring bandwidth requirements in AI data centers (expected to reach 100 Tbps by 2027), high-capacity demands for 5G base stations, and low-latency requirements for intelligent driving. Positioned to address these needs, CPO is set to become the mainstream architecture for next-generation data interconnection. |
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| Want to learn more in-depth analysis of current trends, industry development status, and future market expectations of optoelectronic industry? |
| Register as a visitor now and collect the CIOE Optoelectronics Report! This campaign ends on June 15, and all registered visitors will receive the report on June 18. |
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| Exhibitor Updates |
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GlobalFoundries - Sivers & GlobalFoundries Advance AI Data Center Optical Solutions
The collaboration supports a range of optical connectivity architectures, including co-packaged optics (CPO), linear pluggable optics (LPO), and other emerging data center interconnect solutions.
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Broadcom – Broadcom Accelerates the AI Era with the Industry’s First End-to-End 50G PON Edge AI Portfolio
This launch completes the industry’s most advanced wireless broadband portfolio, pairing 50G PON with a durable Wi-Fi 8 foundation established across four successive waves of market-leading innovation.
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Eoptolink – Eoptolink is using Broadcom's Industry First 400G/lane Optical DSP for Next-Generation 1.6T transceivers
3nm 400G/lane technology enables best-in-class 1.6T transceivers and lays the foundation for 204.8T networks using 3.2T transceivers
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T&S – T&S Introduces 800G OSFP MMC Interface Optical Transceiver
T&S has launched a newly engineered 800G optical transceiver featuring an MMC optical interface, designed to meet the evolving demands of high-performance data centers and next-generation network infrastructures.
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